• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar

Engineering White Papers

White Papers, Catalogs, Case Studies and Resources for Engineers and Professionals

White Papers, Tech Notes, Catalogs and Case Studies

Search White Papers

  • 3D Printing
  • Fastening & Joining
  • Fluid Power
  • Electronics / EE
  • Motion Control
  • Networks
  • Software

Companies

A design engineer’s guide to wire and cable management

August 17, 2022 By

Manage, organize and protect your wire and cable bundles with our vast range of solutions suited for demanding applications and environments. Product Lines Include: Cable clamps with an adhesive … [Read more...] about A design engineer’s guide to wire and cable management

Filed Under: Essentra, New White Papers, White Papers

Curves ahead! IC manufacturing prepares for curvilinear masks

August 16, 2022 By

When manufacturing an integrated circuit, we have always made masks with Manhattan and 45-deg edges. Contact holes, for example, are designed square, even though the shape that is actually printed on … [Read more...] about Curves ahead! IC manufacturing prepares for curvilinear masks

Filed Under: New White Papers, Siemens, White Papers

In search of life on the exoplanets and the Dark Quest

August 15, 2022 By

Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and … [Read more...] about In search of life on the exoplanets and the Dark Quest

Filed Under: New White Papers, Siemens, White Papers

Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope

August 12, 2022 By

Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of … [Read more...] about Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope

Filed Under: New White Papers, Siemens, White Papers

Achieving More than Moore with Heterogeneous Integration

August 11, 2022 By

In this short 15-minute webinar, you’ll learn about heterogeneous integration of chiplets using 3D IC. The primary benefits of this alternative to traditional monolithic SoCs include: Reduced area of … [Read more...] about Achieving More than Moore with Heterogeneous Integration

Filed Under: Siemens, White Papers

Using chiplet design kits to help pave the way for 3D IC heterogenous integration

August 11, 2022 By

A chiplet is an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. Heterogenous integrated (HI) involves integrating multiple die or … [Read more...] about Using chiplet design kits to help pave the way for 3D IC heterogenous integration

Filed Under: Siemens, White Papers

System-level connectivity management and verification of 3D IC heterogeneous assemblies

August 11, 2022 By

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, … [Read more...] about System-level connectivity management and verification of 3D IC heterogeneous assemblies

Filed Under: Siemens, White Papers

Proposed standardization of chiplet models for heterogenous integration

August 11, 2022 By

In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [Read more...] about Proposed standardization of chiplet models for heterogenous integration

Filed Under: Siemens, White Papers

How 3D Printing will become the future of medical devices and equipment manufacturing

August 10, 2022 By

Medtech companies are increasingly discovering the benefits of additive manufacturing (AM) and are embracing the design freedom to produce cost-effective medical devices and equipment that they can … [Read more...] about How 3D Printing will become the future of medical devices and equipment manufacturing

Filed Under: HP, New White Papers, White Papers

Deliver 3D IC innovations faster

August 8, 2022 By

How Siemens 3D IC helps you engineer a smarter future faster One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology … [Read more...] about Deliver 3D IC innovations faster

Filed Under: Siemens, White Papers

  • Go to page 1
  • Go to page 2
  • Go to page 3
  • Interim pages omitted …
  • Go to page 124
  • Go to Next Page »

Primary Sidebar

Search White Papers

Categories

3D CAD 3D Printing 3D Systems Actuators Advanced Materials Ametek Analog Devices Inc. Anritsu Automation Bearings BWC Cables Catalogs CFD Electronics / EE Encoders Faro Fastening & Joining Fluid Power Haydon Kerk HP Hydraulics Intel IoT Linear Motion Mechanical Medical Mentor Graphics Motion Control Motors National Instruments New White Papers Pneumatics Rapid Prototyping Renesas ROLLON Sensors Siemens Silicon Labs Solar Spirol Stratasys Test & Measurement White Papers Wind Power

Copyright © 2022 · WTWH Media, LLC · Privacy Policy