Manage, organize and protect your wire and cable bundles with our vast range of solutions suited for demanding applications and environments. Product Lines Include: Cable clamps with an adhesive … [Read more...] about A design engineer’s guide to wire and cable management
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Curves ahead! IC manufacturing prepares for curvilinear masks
When manufacturing an integrated circuit, we have always made masks with Manhattan and 45-deg edges. Contact holes, for example, are designed square, even though the shape that is actually printed on … [Read more...] about Curves ahead! IC manufacturing prepares for curvilinear masks
In search of life on the exoplanets and the Dark Quest
Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and … [Read more...] about In search of life on the exoplanets and the Dark Quest
Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope
Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of … [Read more...] about Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope
Achieving More than Moore with Heterogeneous Integration
In this short 15-minute webinar, you’ll learn about heterogeneous integration of chiplets using 3D IC. The primary benefits of this alternative to traditional monolithic SoCs include: Reduced area of … [Read more...] about Achieving More than Moore with Heterogeneous Integration
Using chiplet design kits to help pave the way for 3D IC heterogenous integration
A chiplet is an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. Heterogenous integrated (HI) involves integrating multiple die or … [Read more...] about Using chiplet design kits to help pave the way for 3D IC heterogenous integration
System-level connectivity management and verification of 3D IC heterogeneous assemblies
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, … [Read more...] about System-level connectivity management and verification of 3D IC heterogeneous assemblies
Proposed standardization of chiplet models for heterogenous integration
In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [Read more...] about Proposed standardization of chiplet models for heterogenous integration
How 3D Printing will become the future of medical devices and equipment manufacturing
Medtech companies are increasingly discovering the benefits of additive manufacturing (AM) and are embracing the design freedom to produce cost-effective medical devices and equipment that they can … [Read more...] about How 3D Printing will become the future of medical devices and equipment manufacturing
Deliver 3D IC innovations faster
How Siemens 3D IC helps you engineer a smarter future faster One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology … [Read more...] about Deliver 3D IC innovations faster