Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of … [Read more...] about Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope
Siemens
Achieving More than Moore with Heterogeneous Integration
In this short 15-minute webinar, you’ll learn about heterogeneous integration of chiplets using 3D IC. The primary benefits of this alternative to traditional monolithic SoCs include: Reduced area of … [Read more...] about Achieving More than Moore with Heterogeneous Integration
Using chiplet design kits to help pave the way for 3D IC heterogenous integration
A chiplet is an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. Heterogenous integrated (HI) involves integrating multiple die or … [Read more...] about Using chiplet design kits to help pave the way for 3D IC heterogenous integration
System-level connectivity management and verification of 3D IC heterogeneous assemblies
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, … [Read more...] about System-level connectivity management and verification of 3D IC heterogeneous assemblies
Proposed standardization of chiplet models for heterogenous integration
In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [Read more...] about Proposed standardization of chiplet models for heterogenous integration
Deliver 3D IC innovations faster
How Siemens 3D IC helps you engineer a smarter future faster One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology … [Read more...] about Deliver 3D IC innovations faster
Advanced Engineering Simmulation
The International Energy Agency (IEA) predicts, global energy requirements to increase until through 2040. As worldwide decarbonization efforts boost renewable energy usage, wind power is forecasted … [Read more...] about Advanced Engineering Simmulation
IROC Technologies
Ease of use and integration of design software is key to IROC’s success. Faced with a tight schedule and a demanding chip design, IROC turns to Siemens for a digital implementation flow. Aprisa was … [Read more...] about IROC Technologies
Optimizing for best power during place and route in low power SoC designs
IC designers leverage place-and-route software for power-sensitive designs to optimize power first while considering performance, avoiding power recovery late in the flow. Design teams will always … [Read more...] about Optimizing for best power during place and route in low power SoC designs
Scaling analog design power integrity analysis is critical to market success
Today’s technologies are combining processing power with sensors and analog circuitry at a scale that could only be dreamed of in the past. However, market success demands these combined systems also … [Read more...] about Scaling analog design power integrity analysis is critical to market success