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Siemens

In search of life on the exoplanets and the Dark Quest

August 15, 2022 By

Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and … [Read more...] about In search of life on the exoplanets and the Dark Quest

Filed Under: New White Papers, Siemens, White Papers

Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope

August 12, 2022 By

Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of … [Read more...] about Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope

Filed Under: New White Papers, Siemens, White Papers

Achieving More than Moore with Heterogeneous Integration

August 11, 2022 By

In this short 15-minute webinar, you’ll learn about heterogeneous integration of chiplets using 3D IC. The primary benefits of this alternative to traditional monolithic SoCs include: Reduced area of … [Read more...] about Achieving More than Moore with Heterogeneous Integration

Filed Under: Siemens, White Papers

Using chiplet design kits to help pave the way for 3D IC heterogenous integration

August 11, 2022 By

A chiplet is an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. Heterogenous integrated (HI) involves integrating multiple die or … [Read more...] about Using chiplet design kits to help pave the way for 3D IC heterogenous integration

Filed Under: Siemens, White Papers

System-level connectivity management and verification of 3D IC heterogeneous assemblies

August 11, 2022 By

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, … [Read more...] about System-level connectivity management and verification of 3D IC heterogeneous assemblies

Filed Under: Siemens, White Papers

Proposed standardization of chiplet models for heterogenous integration

August 11, 2022 By

In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [Read more...] about Proposed standardization of chiplet models for heterogenous integration

Filed Under: Siemens, White Papers

Deliver 3D IC innovations faster

August 8, 2022 By

How Siemens 3D IC helps you engineer a smarter future faster One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology … [Read more...] about Deliver 3D IC innovations faster

Filed Under: Siemens, White Papers

Advanced Engineering Simmulation

August 8, 2022 By

The International Energy Agency (IEA) predicts, global energy requirements to increase until through 2040. As worldwide decarbonization efforts boost renewable energy usage, wind power is forecasted … [Read more...] about Advanced Engineering Simmulation

Filed Under: New White Papers, Siemens, White Papers, Wind Power

IROC Technologies

August 4, 2022 By

Ease of use and integration of design software is key to IROC’s success. Faced with a tight schedule and a demanding chip design, IROC turns to Siemens for a digital implementation flow. Aprisa was … [Read more...] about IROC Technologies

Filed Under: Newsletters, Siemens, White Papers

Optimizing for best power during place and route in low power SoC designs

August 4, 2022 By

IC designers leverage place-and-route software for power-sensitive designs to optimize power first while considering performance, avoiding power recovery late in the flow. Design teams will always … [Read more...] about Optimizing for best power during place and route in low power SoC designs

Filed Under: New White Papers, Siemens, White Papers

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