The promise of autonomous vehicles is driving profound changes in the design and testing of automotive semiconductor parts. Automotive ICs, once deployed for simple functions like controlling windows, … [Read more...] about Management of test, safety and security data at the edge for ISO 26262
Siemens
The design lifecycle of an electronics interface
Design and verification of electronic systems can be a challenging process, from the 100-plus page specification to the detailed measurements on the prototype in the lab. It’s even worse if your … [Read more...] about The design lifecycle of an electronics interface
A place-and-route paradigm shift
Aprisa overcomes advanced-node design complexities by taking into account the impact of detailed route information throughout the entire physical design flow. Aprisa’s unified data model (UDM) … [Read more...] about A place-and-route paradigm shift
Modeling ECD with machine learning to improve CMP simulation
Accurate modeling of post-ECD surface topography variation is crucial for correct CMP simulation. Siemens and the American University of Armenia collaborated to investigate and evaluate the use of … [Read more...] about Modeling ECD with machine learning to improve CMP simulation
Full-flow tool suite for custom analog and mixed-signal designs
Analog and Mixed/Signal IC designers face significant developmental challenges and unforgiving time-to-market expectations. This white paper explores how to solve those challenges. Download this … [Read more...] about Full-flow tool suite for custom analog and mixed-signal designs
Charting a path to operational excellence with smart manufacturing
Medical device manufacturers have traditionally used paper-based methods to guide and track the execution of manufacturing processes, including paper device history records (DHR). But industry leaders … [Read more...] about Charting a path to operational excellence with smart manufacturing
Siemens, AMD, and Microsoft collaborate on EDA in the cloud
Moving some or all of your EDA computing to the cloud enables your company to reduce time-to-market and innovate faster by taking advantage of flexible cloud resources and economies of scale. Siemens … [Read more...] about Siemens, AMD, and Microsoft collaborate on EDA in the cloud
New approaches to physical verification closure and cloud computing come to the rescue in the EUV era
Time-to-market is a critical commodity in the electronics industry, as is the cost-effective use of resources and engineer expertise. EDA suppliers constantly evaluate design information from both … [Read more...] about New approaches to physical verification closure and cloud computing come to the rescue in the EUV era
Calibre in the Cloud: Unlocking massive scaling and cost efficiencies
As companies look to leverage cloud capacity for faster turnaround times on advanced process node designs, they can be confident that running Calibre in the cloud provides the same sign-off … [Read more...] about Calibre in the Cloud: Unlocking massive scaling and cost efficiencies
Critical area based test pattern optimization for high-quality test
Among the challenges for DFT engineers is how to set a target metric for ATPG and how to choose the best set of patterns. Traditional coverage targets based on the number of faults detected doesn’t … [Read more...] about Critical area based test pattern optimization for high-quality test