Embedded system RFID and smartphone credential readers come with a broad range of form factors, capabilities and configurations. When evaluating a reader to embed into a system or device, it is essential to ensure it will continue to meet your needs for years to come as device specification and end-user requirements change.
Here are 11 considerations for product managers, embedded system engineers and solution architects when evaluating an RFID module solution. This handy checklist will help you optimize your RFID reader selection, engineering design process, life-long device performance and customer satisfaction.
Download the white paper from Elatec USA to learn more…
Emulation, combined with a rich assortment of virtualized versions of the many protocols that 5G will require, is the only practical way of ensuring that the first round of silicon built will be the production version, able to handle all of the functions and configurations that it might be faced with and having the tight performance characteristics needed for successful integration into a 5G system.
When designing the printed circuit board (PCB) layout for any high-power or high-voltage system, the gate drive circuitry can be particularly susceptible to parasitic impedances and signals. Following specific PCB design guidelines can help mitigate these common pitfalls and eliminate failures in the lab or in the field.
Moving machine learning to the edge has critical requirements on power and performance. Using off-the-shelf solutions is not practical. CPUs are too slow, GPUs/TPUs are expensive and consume too much power, and even generic machine learning accelerators can be overbuilt and are not optimal for power. In this paper, learn about creating new power/memory efficient hardware architectures to meet next-generation machine learning hardware demands at the edge.
The rising interest in AI-first solution modeling suggests that a rethinking of conventional industrial robotics design and development is needed. Rather than relying on an approach in which existing machine operations are essentially augmented by bolting on AI-driven components, AI-first puts the intelligence at the forefront of the design process to perform at the core of a task.
High-speed sockets and adapters continue to perform important functions for today’s IC component and electronics packaging engineers. Whether for testing, prototyping, or production, these components typically require an ever-increasing level of electrical and mechanical performance. In the area of electrical performance, it is particularly important that an accurate predictive model be available for performance at GHz frequencies.
When designing data cabinets, home appliances, office equipment, cable junction boxes or anything that involves electronics, PCB hardware are integral components for your project. This guide will help you understand the different components that can enhance the performance of your printed circuit board design.
This article showcases how DAQ solutions evolve to be more complete signal chain solutions via system-in-package (SiP) technology, the supply decoupling can be co-packaged with the precision signal chain to improve the overall system PSRR.
This article discusses the issues with using peak current as a deciding factor when selecting a gate driver and compares some of the more common representations of peak current.
Sampling phenomena in analog-to-digital converters (ADCs) induce the problems of aliasing and capacitive kickback. This article describes continuous-time sigma-delta (∑-Δ) ADCs that inherently and dramatically solve the sampling problems by simplifying signal chains.