AGVs, off-road utility equipment (forestry agriculture, construction, mining, etc.), railway maritime and avionics applications in the industrial industry rely on highly flexible small form factor … [Read more...] about An Answer to your Need for Compact, Rugged Computer Systems
White Papers
EDA in the cloud – Now more than ever
The cloud is now a viable option for IC verification. But what is the value of cloud computing to my company? Understand the history of EDA in the cloud, then explore the ways your company can best … [Read more...] about EDA in the cloud – Now more than ever
Reliability verification in the cloud delivers significant runtime benefits
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. “Not on premises” cloud compute environments provide a scalable and … [Read more...] about Reliability verification in the cloud delivers significant runtime benefits
Accelerate time to market with Calibre nmLVS Recon technology: A new paradigm for circuit verification
One thing is clear…tapeouts are getting harder, and taking longer. As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design … [Read more...] about Accelerate time to market with Calibre nmLVS Recon technology: A new paradigm for circuit verification
What is behind the drive towards Terahertz technology of 6G?
Discussion of beyond 5G and 6G topics has started in the academic and research communities, and several research projects are now starting to address the future technology requirements. One part of … [Read more...] about What is behind the drive towards Terahertz technology of 6G?
The Future of Wi-Fi in Low-Power IoT Devices
Wi-Fi is the most widely used wireless standard in use today, but only recently has it emerged as a viable option for IoT applications. That changed when Wi-Fi 4 made the standard more cost and … [Read more...] about The Future of Wi-Fi in Low-Power IoT Devices
Bluetooth SoC and Module Selector Guide by Silicon Labs
Bluetooth offers developers and manufacturers one of the world’s fastest-growing wireless connectivity technologies. In fact, 5.4 billion Bluetooth-enabled IoT devices are expected to be shipped by … [Read more...] about Bluetooth SoC and Module Selector Guide by Silicon Labs
Toggle Clamps & Workholding
Toggle Clamps use a linkage system to increase force applied to the handle to tightly secure objects. Saving valuable space without sacrificing holding capacity or clamp performance. In this … [Read more...] about Toggle Clamps & Workholding
Five key workflows that deliver 3D IC packaging success
Several factors are converging and driving the chiplet design revolution. This paper explores these factors and outlines five key workflows that address and manage the associated, new challenges. The … [Read more...] about Five key workflows that deliver 3D IC packaging success
Proposed standardization of chiplet models for heterogenous integration
In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [Read more...] about Proposed standardization of chiplet models for heterogenous integration