As the world continues to demand more performance, bandwidth, and capacity from smaller, lighter, and lowerpower products, so the increase in High Density Advance Packaging (HDAP) usage will grow.
Extremely-high pin-count devices, such as ECUs, APUs, CPUs, GPUs, MCUs, and FPGAs, have changed the way engineers plan and implement each device’s external interfaces, or I/Os. To meet overall component criteria, such as size, thickness, performance, power, and cost, design trade-offs must be made between the chip(s) and its package. Different form factors for similar end products also mandate that different board-level platforms be considered.
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