Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these packages assembled onto a printed circuit board (PCB), they perform certain functions at certain speeds. Socketing is one of the avenues to mount IC packages to PCB semi permanently. Socketing high-speed, high-density IC packages requires an innovative solution to challenges of designing a socket with shorter signal path, good electrical insulation, and proper thermal management.
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