CMP simulation is a valuable tool for determining the optimum CMP process to use during chip manufacturing. Large surface topography variations generated after ECD affect the post-CMP surface profile. In addition, weak long-range interactions of patterns on the design are inherent for post-ECD surface profiles, which means that the surface height above the given pattern is not defined solely by the pattern itself, but is affected by neighbor patterns. The ability to create an accurate post-ECD model is essential to successful CMP simulation.
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