As feature sizes decrease there is a growing need for chemical-mechanical polishing (CMP) modeling to better understand how the design layout impacts planarity. CMP modeling has proven to be very effective in simulating the profile when a process has a well-defined physics based model. In this IC design white paper, we discuss how machine learning can be used to develop an accurate deposition model for a new process that lack a proven physics-based model.
Download this white paper from Mentor Graphics to learn more…