How Siemens 3D IC helps you engineer a smarter future faster
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, a growing number of companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets (implemented in different processes geometries) into 3D ICs. Chiplets are small ICs specifically designed and optimized for operation within a package in conjunction with other chiplets and full-sized ICs.
Download the whitepaper from Siemens to learn more.