Is it time to say goodbye to costly molds, tooling, and lengthy setup times? 3DEO uses Intelligent Layering®, a patented “bind and sinter” technology that does not use an inkjet printhead. This intra-layer capability allows for strategies like multi-layer processing and dynamic layer thickness. This white paper lists the technical specifications of the INΤΕLLIGENT LAYERING® technology, along with its advantages.
Download the white paper from 3DEO to learn more…