Thermal gap fillers are used to fill air gaps between components in an electronic assembly or electronic system to enhance thermal behavior. These materials are ideal for filling gap openings that result from design restraints that don’t allow for direct contact of the heat source and cold surface. Thermal gap fillers are different from thermal greases, which are designed to break down contact resistance, rather than fill gaps. Traditional gap fillers often use ceramic fillers, such as aluminum oxide or boron nitrite, to achieve a desired thermal conductivity. These fillers are typically selected because of their high conductivity and proven performance.
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