Thermally conductive adhesives and potting compounds are an important weapon in the war against heat raging within today’s powerful electronic devices.
Electronics are hot right now—literally. Chip makers have significantly upped the ante on microprocessor power
and density over the past decade. And these powerful microprocessors are shoehorned into tiny mobile and embedded devices that make thermal management all the more difficult. Design engineers charged with keeping these devices cool have a big challenge on their hands.