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Mineral-Cast Machine Bases: The Vibration-Free Foundation for Environmental Protection

March 22, 2023 By

Eliminate Production Machinery Vibration for Greater Speed and Precision — While Committing to Sustainability In manufacturing applications that demand ever-higher precision, the production … [Read more...] about Mineral-Cast Machine Bases: The Vibration-Free Foundation for Environmental Protection

Filed Under: New White Papers, White Papers

Using Bluetooth as a Location Technology

February 16, 2023 By

RF-based technologies have served as the backbone of location-tracking for years, but engineers are looking for new options that can overcome the limitations of these technologies such as security … [Read more...] about Using Bluetooth as a Location Technology

Filed Under: New White Papers, Silicon Labs, White Papers

Reliable Linear Motion For Packaging Machines

February 13, 2023 By

In the productivity-driven packaging industry, there are many possible sources of downtime. You can eliminate many of them by selecting failure-resistant linear motion components. These robust guides … [Read more...] about Reliable Linear Motion For Packaging Machines

Filed Under: Iko, Linear Motion, New White Papers, White Papers

Harnessing the Power of Wi-Fi 6 in the IoT

February 9, 2023 By

Wi-Fi 6 is the newest standard designed to support Wi-Fi as a core element of IoT infrastructure. With some devices already achieving Wi-Fi 6 certification, most will support Wi-Fi 6 by 2026. Beyond … [Read more...] about Harnessing the Power of Wi-Fi 6 in the IoT

Filed Under: New White Papers, White Papers

IC Socket – Carrier for Semiconductor Devices in Finished Product

February 8, 2023 By

Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these packages assembled onto a printed circuit … [Read more...] about IC Socket – Carrier for Semiconductor Devices in Finished Product

Filed Under: New White Papers, White Papers

HP Metal Jet Technology: HP’s digital printing technology for metals

January 5, 2023 By

Three-dimensional (3D) printing of complex applications and machine components is a reality. 3D printing offers the ability to produce rapidly and at low cost both industrial-scale runs of high-value … [Read more...] about HP Metal Jet Technology: HP’s digital printing technology for metals

Filed Under: HP, New White Papers, White Papers

HP 3D Printing supports the APCC’s high-volume production and allows for creativity to invent new applications

December 22, 2022 By

HP Inc.’s Americas Product Completion Center (APCC) in Richmond, Virginia, packages HP Inkjet supplies and prepares them for shipping to destinations in North and South America. As one of four centers … [Read more...] about HP 3D Printing supports the APCC’s high-volume production and allows for creativity to invent new applications

Filed Under: HP, New White Papers, White Papers

HP Multi Jet Fusion Helps Campetella Robotic Center Reduce Lead Time and Cost

December 15, 2022 By

Campetella Robotic Center is an Italian company specialized in the production of industrial robots and automation systems. Since 1897, Campetella has been involved in producing technological … [Read more...] about HP Multi Jet Fusion Helps Campetella Robotic Center Reduce Lead Time and Cost

Filed Under: 3D Printing, Additive Manufacturing, HP, New White Papers, White Papers

Curves ahead! IC manufacturing prepares for curvilinear masks

November 22, 2022 By

When manufacturing an integrated circuit, we have always made masks with Manhattan and 45-deg edges. Contact holes, for example, are designed square, even though the shape that is actually printed on … [Read more...] about Curves ahead! IC manufacturing prepares for curvilinear masks

Filed Under: New White Papers, Siemens, White Papers

Taking 2.5D/3DIC physical verification to the next level

November 17, 2022 By

As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can use Calibre 3DSTACK physical … [Read more...] about Taking 2.5D/3DIC physical verification to the next level

Filed Under: New White Papers, Siemens, White Papers

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