Siemens

Introducing mPower – the only tool suite that performs simulation-based EM/IR analysis for fast, accurate power integrity analysis for analog designs. As the explosion in edge computing drives … [Read more...] about Scaling analog design power integrity analysis is critical to market success

Introducing mPower – Integrated power integrity verification solution for analog, digital, and 3D IC Power integrity analysis evaluates circuits to determine if they will provide their … [Read more...] about Introducing mPower: Uncompromised power integrity for the whole design, at any scale

How did UPMEM’s PIM-DRAM design secure fast, accurate power analysis from floorplanning through tapeout? UPMEM’s innovative PIM-DRAM module offers the IC industry potentially significant savings in … [Read more...] about Innovative UPMEM PIM-DRAM requires the innovative power integrity analysis of the mPower toolsuite

The cloud is now a viable option for IC verification. But what is the value of cloud computing to my company? Understand the history of EDA in the cloud, then explore the ways your company can best … [Read more...] about EDA in the cloud – Now more than ever

Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. “Not on premises” cloud compute environments provide a scalable and … [Read more...] about Reliability verification in the cloud delivers significant runtime benefits

One thing is clear…tapeouts are getting harder, and taking longer. As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design … [Read more...] about Accelerate time to market with Calibre nmLVS Recon technology: A new paradigm for circuit verification

Several factors are converging and driving the chiplet design revolution. This paper explores these factors and outlines five key workflows that address and manage the associated, new challenges. The … [Read more...] about Five key workflows that deliver 3D IC packaging success

Electronic systems of all sizes are routinely being integrated into single integrated circuits (ICs). While the largest systems-on-chip (SoC) make headlines, there are numerous small and medium SoCs … [Read more...] about Veloce proFPGA increases design efficiency and brings SoCs to market faster

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial … [Read more...] about Veloce prototyping solutions accelerate verification of HPC AI-enabled SoCs