When manufacturing an integrated circuit, we have always made masks with Manhattan and 45-deg edges. Contact holes, for example, are designed square, even though the shape that is actually printed on wafer is a circle. It turns out that the ideal mask pattern to print such a circle is in fact a circle; the ultimate process-window-maximizing curvilinear mask shape. Curvilinear masks are now possible using multi-beam … [More] about Curves ahead! IC manufacturing prepares for curvilinear masks
Main Content
WHITE PAPERS
Taking 2.5D/3DIC physical verification to the next level
As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can use Calibre 3DSTACK physical … [More] about Taking 2.5D/3DIC physical verification to the next level
Crossed Roller Bearings: Features and Applications
When your machine design requires rotational mechanisms to handle complex loads and position an object, there’s no doubt precision and small size will be among your most significant criteria when … [More] about Crossed Roller Bearings: Features and Applications
Parasitic extraction of MIM/MOM capacitor devices in analog/RF designs
The extensive use of MIM/MOM capacitors in analog/RF designs presents parasitic extraction challenges to designers. Understanding best practices and recommended tools for extracting the complex … [More] about Parasitic extraction of MIM/MOM capacitor devices in analog/RF designs
Polymers Outperform Metals In Precision Gearing
Gears, especially in open gearing applications, share a set of well-known performance problems that crop up again and again across many different applications. … [More] about Polymers Outperform Metals In Precision Gearing
Scaling analog design power integrity analysis is critical to market success
Today’s technologies are combining processing power with sensors and analog circuitry at a scale that could only be dreamed of in the past. However, market success demands these combined systems also … [More] about Scaling analog design power integrity analysis is critical to market success
Introducing mPower: Uncompromised power integrity for the whole design, at any scale
Power integrity analysis evaluates circuits to determine if they will provide their designed/intended performance and reliability as implemented. Designers must be able to verify analog and digital … [More] about Introducing mPower: Uncompromised power integrity for the whole design, at any scale
Parasitic extraction challenges and solutions for 5G IC design
To fulfill the performance promise of 5G while ensuring 5G IC designs can be successfully manufactured in commercial quantities, designers of 5G chips and networks need accurate, automated parasitic … [More] about Parasitic extraction challenges and solutions for 5G IC design
Siemens, AMD, and Microsoft collaborate on EDA in the cloud
Moving some or all of your EDA computing to the cloud enables your company to reduce time-to-market and innovate faster by taking advantage of flexible cloud resources and economies of scale. Siemens … [More] about Siemens, AMD, and Microsoft collaborate on EDA in the cloud
Succeeding with Connector Miniaturization in Automotive Systems
Automotive system designers face the combined challenges of increasing electronics content, including a growing number of electronic control units (ECUs), demands for smaller solutions, and less … [More] about Succeeding with Connector Miniaturization in Automotive Systems
eBook: Deliver 3D IC innovations faster
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To … [More] about eBook: Deliver 3D IC innovations faster
More Thank Just Motor Size: Use Application Information to Size Your Gearbox Correctly
Get the most performance and reliability from your right angle gearbox with these tips. When your equipment calls for a right angle gearbox, proper sizing makes a difference. However, simply … [More] about More Thank Just Motor Size: Use Application Information to Size Your Gearbox Correctly
Industrial AGVs: Improving Productivity and Space Efficiency with Smart, Compact Electric Actuators
Automated guided vehicles (AGVs) can improve industrial productivity by 50 to 70 percent but require adequate room to move about increasingly space-constrained factory floors. The more functionality … [More] about Industrial AGVs: Improving Productivity and Space Efficiency with Smart, Compact Electric Actuators
IEC 61508 Overview: The Guide for Functional Safety in Industrial Manufacturing
Learn the details of IEC 61508, best practices, and how to achieve compliance. In our eBook, we examine: - What IEC 61508 is, and why it matters - The seven parts of the functional safety … [More] about IEC 61508 Overview: The Guide for Functional Safety in Industrial Manufacturing
An Introduction To Shock, Impact, & The Action Of Viscoelastic Materials
Physical (mechanical) shock can damage an entire object or a single element of that object. In the featured image above the entire light bulb may be destroyed by shock or just the filament within. … [More] about An Introduction To Shock, Impact, & The Action Of Viscoelastic Materials
Enhanced interconnect medium simplifies test & verification
In high performance embedded systems test application, the requirement for accurate measurement of AC and DC parameter is often critical. During development phase, IC devices are not permanently … [More] about Enhanced interconnect medium simplifies test & verification
Practical Guide to Discrete Sensors
There are many types of object detection sensors available on the market. Some of them, such as limit switches, require direct contact with the object. Others, such as proximity sensors, need to be in … [More] about Practical Guide to Discrete Sensors
Selecting the Right Transformer for Your Application
Power transformers play a key role in any electrical distribution system, and also for end-use equipment like industrial control panels. Although many engineers, designers, and installers encounter … [More] about Selecting the Right Transformer for Your Application
Practical Guide to Electrical Enclosures
This Enclosures Handbook includes chapters on Enclosure Types, Understanding Enclosure NEMA and IP Ratings, Selecting an Enclosure, Thermal Management Solutions and more. It is a great resource for … [More] about Practical Guide to Electrical Enclosures
Guide To Power Products from Automation Direct
Electrical power products provide safe and efficient power services for industrial and commercial use, from incoming facility power to endpoint distribution and filtering. In this guide you will learn … [More] about Guide To Power Products from Automation Direct
How Industrial Leaders Are Automating Thermal Inspection
Identifying problems before they cause equipment failure and costly, unplanned downtime is the purpose of proactive and predictive maintenance programs. Learn how automated thermal inspections are … [More] about How Industrial Leaders Are Automating Thermal Inspection
Technical Brief – “Understanding the Extensive Benefits of Total Linear Positioning Systems.”
When a group of components work together and create the most cost-effective solution for machine movement, that’s a linear motion system. And linear motion technology designed as a system best … [More] about Technical Brief – “Understanding the Extensive Benefits of Total Linear Positioning Systems.”
A design engineer’s guide to wire and cable management
Manage, organize and protect your wire and cable bundles with our vast range of solutions suited for demanding applications and environments. Product Lines Include: Cable clamps with an adhesive … [More] about A design engineer’s guide to wire and cable management
Curves ahead! IC manufacturing prepares for curvilinear masks
When manufacturing an integrated circuit, we have always made masks with Manhattan and 45-deg edges. Contact holes, for example, are designed square, even though the shape that is actually printed on … [More] about Curves ahead! IC manufacturing prepares for curvilinear masks
In search of life on the exoplanets and the Dark Quest
Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and … [More] about In search of life on the exoplanets and the Dark Quest
Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope
Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of … [More] about Analog-to-digital conversion is key for deep space exploration with the James Webb Space Telescope
Achieving More than Moore with Heterogeneous Integration
In this short 15-minute webinar, you’ll learn about heterogeneous integration of chiplets using 3D IC. The primary benefits of this alternative to traditional monolithic SoCs include: Reduced area of … [More] about Achieving More than Moore with Heterogeneous Integration
Using chiplet design kits to help pave the way for 3D IC heterogenous integration
A chiplet is an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. Heterogenous integrated (HI) involves integrating multiple die or … [More] about Using chiplet design kits to help pave the way for 3D IC heterogenous integration
System-level connectivity management and verification of 3D IC heterogeneous assemblies
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, … [More] about System-level connectivity management and verification of 3D IC heterogeneous assemblies
Proposed standardization of chiplet models for heterogenous integration
In this paper, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and … [More] about Proposed standardization of chiplet models for heterogenous integration
How 3D Printing will become the future of medical devices and equipment manufacturing
Medtech companies are increasingly discovering the benefits of additive manufacturing (AM) and are embracing the design freedom to produce cost-effective medical devices and equipment that they can … [More] about How 3D Printing will become the future of medical devices and equipment manufacturing
Deliver 3D IC innovations faster
How Siemens 3D IC helps you engineer a smarter future faster One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology … [More] about Deliver 3D IC innovations faster
Advanced Engineering Simmulation
The International Energy Agency (IEA) predicts, global energy requirements to increase until through 2040. As worldwide decarbonization efforts boost renewable energy usage, wind power is forecasted … [More] about Advanced Engineering Simmulation
Matter Security: Applying Privacy Fundamentals to Smart Home Devices
Matter promises to enable smart home devices of different brands to communicate across ecosystems and address consumer requirements of easy setup and hassle-free interoperability, bringing peace of … [More] about Matter Security: Applying Privacy Fundamentals to Smart Home Devices
IROC Technologies
Ease of use and integration of design software is key to IROC’s success. Faced with a tight schedule and a demanding chip design, IROC turns to Siemens for a digital implementation flow. Aprisa was … [More] about IROC Technologies
Optimizing for best power during place and route in low power SoC designs
IC designers leverage place-and-route software for power-sensitive designs to optimize power first while considering performance, avoiding power recovery late in the flow. Design teams will always … [More] about Optimizing for best power during place and route in low power SoC designs