Historically component temperature has been correlated with reliability, with early studies relating field failure rates to component temperature. More recently physics-based reliability prediction has related failure rates of electronic assemblies to the magnitude of temperature change over an operational cycle (power-on, power-off, power-on…), and rate of temperature change, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, improve performance, or avoid problems during operation, accurate prediction of component temperatures helps thermal designers to achieve their goals.