FCC compliance for radiated emissions is an increasingly difficult challenge for designers of electronic systems. Proper component selection expecting to pass a final FCC system test, for radiated emissions, has perplexed system design engineers for decades. The study of Radiated Electric Field Pattern simulations, often used for antenna analysis, is employed herein to evaluate the radiation properties of individual components across a family of low-cost, high-performance interconnects. Various techniques are evaluated to improve the shielding performance of the interconnect components.
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