As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can use Calibre 3DSTACK physical verification checks to verify die alignments for proper connectivity and electrical behavior. The Calibre 3DSTACK precheck mode enables design teams to find and correct basic implementation mistakes and systemic errors before invoking the Calibre 3DSTACK signoff run, eliminating unnecessary debugging iterations and speeding up the overall package verification flow.
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