Rather than using numerous through-holes in a multi-layer PCB, designers have found that using blind and buried vias can tremendously increase routing density. Learn the best ways to design with vias in this whitepaper from Advanced Assembly.
In this whitepaper, you will learn:
- Seven types of vias
- Drilling microvias
- Using vias with (BGAs) ball grid arrays
- Via-in-pad designs
Download this white paper…