IMPLEMENTING AUTOMATED PICK-AND-PLACE FOR THERMAL GAP FILLER PADS
The ever-growing miniaturization of electronic components pushes the boundaries of automated assembly. While pick-and-place technology reigns supreme for most components, one area remains stubbornly manual: thermal gap filler pads. These pre-cut, non-viscous thermal interface materials, unlike dispensables, require precise handling akin to component placement. Despite their crucial role in heat dissipation, application often occurs manually, demanding meticulous peeling and placement.
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