Fujipoly

IMPLEMENTING AUTOMATED PICK-AND-PLACE FOR THERMAL GAP FILLER PADS The ever-growing miniaturization of electronic components pushes the boundaries of automated assembly. While pick-and-place … [Read more...] about The Promise of Streamlined Production

Thermal gap fillers are used to fill air gaps between components in an electronic assembly or electronic system to enhance thermal behavior. These materials are ideal for filling gap openings that … [Read more...] about More Conductivity, Less Compression: The Advantages of Carbon-Based Thermal Gap Fillers

When designing electronic systems, it is very easy to forget about real-world limitations and effects that would not otherwise affect a circuit. For example, a circuit that works in theory (i.e., … [Read more...] about Addressing Thermal Management Challenges with Silicone-Based Solutions

Compression characteristics are a key function of gap fillers. Unlike thermal greases, the applications for gap fillers are quite different. Being mindful of compression characteristics and the … [Read more...] about Compression Characteristics of Thermal Interface Gap Filler Materials

This paper focuses on the characteristics of gap fillers and how they impact a printed circuit board (PCB) including compression characteristics of various types of gap fillers, from standard … [Read more...] about Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress